Scanning acoustic microscope ( sam ) can be used to detect package delaminations and quickly identify the failure cause at the early stage of failure analysis 扫描声学显微镜可以用来检测封装分层，能在失效分析的早期阶段快速地鉴别失效原因。
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A scanning acoustic microscope ( sam ) can be used to detect package delaminations and quickly identify the failure cause at the early stage of failure analysis 扫描声学显微镜可以用来检测封装分层，能在失效分析的早期阶段快速地鉴别失效原因。
